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CoolSteps Rev2.1 released

Posted by Ignatius Havemann on October 15, 2013  /   Posted in Blog

15 October 2013 РAfter receiving a request for modified CoolSteps 2 drivers to enable fast decay Рused on Morgan printers Рwe decided to update the PCB to make things easier for you! We added a solder jumper on the bottom of the PCB to enable fast decay, mixed decay by default.

Enter CoolSteps 2.1!


Includes anodized heatsink, SIL header strips and thermal adhesive tape.

Thermal adhesive note:

  • High performance, thermally conductive, pressure sensitive adhesive.
  • Material immediately bonds to the target surface.
  • Bond strength increases over time when repeatedly exposed to high continuous-use temperatures.

Due to the small size of the tape, it is not a very strong bond but it is far superior to placing big nuts and thermal paste on top of the driver IC’s!

DRV8825 Datasheet


  1. John October 22, 2013 8:39 pm / Reply

    I need these! Will you ship to France?

  2. Hannes May 7, 2014 12:19 pm / Reply

    Hi, where do I see your prices and where do one order?

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