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CoolSteps Rev2.1 released

Posted by Ignatius Havemann on October 15, 2013  /   Posted in Blog

15 October 2013 РAfter receiving a request for modified CoolSteps 2 drivers to enable fast decay Рused on Morgan printers Рwe decided to update the PCB to make things easier for you! We added a solder jumper on the bottom of the PCB to enable fast decay, mixed decay by default.

Enter CoolSteps 2.1!

CoolSteps2.1_web

Includes anodized heatsink, SIL header strips and thermal adhesive tape.

Thermal adhesive note:

  • High performance, thermally conductive, pressure sensitive adhesive.
  • Material immediately bonds to the target surface.
  • Bond strength increases over time when repeatedly exposed to high continuous-use temperatures.

Due to the small size of the tape, it is not a very strong bond but it is far superior to placing big nuts and thermal paste on top of the driver IC’s!

DRV8825 Datasheet

4 Comments

  1. John October 22, 2013 8:39 pm / Reply

    I need these! Will you ship to France?

  2. Hannes May 7, 2014 12:19 pm / Reply

    Hi, where do I see your prices and where do one order?

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